As a global leader in memory solutions, SK hynix has taken a significant leap forward by introducing its cutting-edge HBM4 technology to the world. This unveiling occurred during a presentation at TSMC’s North American Technology Symposium, marking a pivotal moment for the company that stands ahead of its competitors in this arena. The company aims to commence mass production of HBM4 memory in the latter half of the year.
The newly showcased HBM4 memory from SK hynix boasts up to 48 GB capacity, 2.0 TB/s bandwidth, and impressive 8.0 Gbps I/O speeds. The innovation features a 16-layer chip configuration, representing a substantial advancement for AI and high-performance computing (HPC) applications. The company has scheduled the mass production of HBM4 for the second half of 2025, indicating that HBM4-enabled products could emerge in the market by year’s end.
Underpinning this technological achievement are SK hynix’s advanced methods, notably MR-MUF (Mass Reflow Molded Underfill) and TSV (Through Silicon Via) technologies. These processes ensure a more stable and efficient connection of multilayer structures. Presently, SK hynix is the sole manufacturer offering HBM4 technology to the public, providing it a competitive edge over rivals like Micron and Samsung, who remain in the sampling phase.
In addition to HBM4, SK hynix has also introduced its advanced 16-layer HBM3E solution, which delivers 1.2 TB/s bandwidth. This technology is poised to enhance GB300 AI clusters relying on Nvidia’s Blackwell Ultra architecture. Nvidia is expected to migrate to HBM4 with the upcoming Vera Rubin platform.
The symposium was an opportunity for SK hynix to showcase more than just its HBM solutions. The company also presented new server memory modules, including RDIMM and MRDIMM products based on the next-generation 1c DRAM standard. These modules promise remarkable speeds of 12.5 GB/s, significantly boosting server and data center performance. Noteworthy offerings include MRDIMMs with 12.8 Gbps speeds and capacities of 64 GB, 96 GB, and 256 GB; RDIMM modules at 8 Gbps with 64 GB and 96 GB capacities; and a 3DS RDIMM variant featuring a 256 GB capacity.
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