TSMC Expands Chip Manufacturing in the United States

TSMC‘s Strategic U.S. ExpansionTSMC, the global leader in semiconductor manufacturing, has unveiled ambitious plans to produce 30 percent of its 2nm-class (N2) and more advanced chips within the United States. This initiative is centered around their Fab 21 facility located near Phoenix, Arizona, which is set to become a self-sufficient semiconductor production hub. The company is intensifying efforts to accelerate the construction of new Fab 21 modules for the production of chips with N3 (3nm class), N2, and A16 (1.6nm class) technologies. This strategic expansion significantly bolsters the localization of the chip manufacturing process in the U.S.Enhancing U.S. Manufacturing Capabilities”Upon completion, approximately 30% of our 2nm and more advanced capacity will be located in Arizona, creating an independent leading-edge semiconductor manufacturing cluster in the US,” stated C.C. Wei, CEO and President of TSMC, during their financial results briefing. Wei emphasized that this investment is poised to strengthen the supply chain ecosystem. To achieve this, TSMC is planning the construction of two additional modules at its Fab 21 site. Concurrently, the company is preparing to activate three N2 and A16 (1.6nm class) fab modules in Taiwan.Currently, Fab 21 module 1 in Arizona is in full-scale production with N4 and N5 technologies, catering specifically to American clients. The completion of module 2’s construction, designated for 3nm production, has been achieved, and equipment installation is slated to commence ahead of schedule. TSMC is targeting the initiation of volume production on this module prior to 2028.The construction of Fab 21 module 3 and module 4, dedicated to N2 and A16 production, is anticipated to begin in 2025, contingent upon obtaining the requisite permits. At least one of these modules is projected to be operational by early 2029.TSMC’s vision extends further with plans to incorporate module 5 and module 6 at the Fab 21 site to facilitate production beyond A16 (encompassing A14 and subsequent technologies). The timeline for these modules will largely be dictated by market demand. When fully realized, Fab 21 in Arizona aims to evolve into a colossal “GigaFab” facility, boasting a production capacity of 100,000 wafers monthly.

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