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MediaTek’s Dimensity 9400+: A Leap in Smartphone Technology

MediaTek’s Dimensity 9400+: A Leap in Smartphone Technology

ABONE OL
Nisan 16, 2025 04:12
MediaTek’s Dimensity 9400+: A Leap in Smartphone Technology
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MediaTek Unveils the Dimensity 9400+: A Game-Changer in Mobile Technology

MediaTek, a leading technology powerhouse based in Taiwan, is set to redefine smartphone capabilities with its latest innovation, the Dimensity 9400+. This enhanced version of the high-end system-on-chip promises remarkable advancements in CPU performance, artificial intelligence, and several other domains, poised to power the next generation of high-end smartphones.

Among the standout features of the Dimensity 9400+ is its revolutionary Bluetooth technology. The chip achieves an unprecedented phone-to-phone Bluetooth range of up to 10 km in direct line of sight. This feat is made possible through dual Bluetooth engines, marking the advent of Bluetooth 6.0, which boasts data rates reaching up to 12 Mbps. In comparison to its predecessor, the Dimensity 9400, this upgrade extends the Bluetooth range over sixfold from a previous 1.5 km. MediaTek highlights the benefit of these ultra-long-range connections, which operate independently of cellular services, thereby conserving data usage and enhancing privacy. Additionally, this functionality offers a crucial solution for regions with limited access to satellite internet solutions like Starlink.

The Dimensity 9400+ also introduces significant performance enhancements. The Cortex-X925 core now clocks in at 3.73 GHz, up from the previous model’s 3.62 GHz, delivering superior processing power. In the realm of AI, the chip’s performance sees a 20% improvement, courtesy of the NPU 890, augmented by Speculative Decoding+ (SpD+) support. This chip’s capability to run large language models such as DeepSeek-R1-Distill on-device pushes the AI experience to new heights.

MediaTek’s latest Frame Rate Converter 2.0+ introduces a significant advancement with its ability to double the effective FPS on devices while enhancing power efficiency by as much as 40%. Furthermore, the chip improves TTFF (time to first fix) by 33% without relying on a cellular connection, thanks to support for BeiDou satellite technology. On the connectivity frontier, the chip includes updated Wi-Fi 7 with a 5-stream (2×2 + 2×2 + 1×1) tri-band concurrency, focusing on increased data throughput and reliability.

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MediaTek has announced that smartphones featuring the Dimensity 9400+ will make their debut later this month, offering users an enriched experience driven by this innovative chip.

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